DHAKA, May 12,( V7N )— As part of its global semiconductor roadshow, the Bangladesh Semiconductor Industry Association (BSIA) has completed a full day of engagements in South Korea. The roadshow is designed to deepen international cooperation, grow talent, and push forward advanced semiconductor packaging as Bangladesh works to establish its own semiconductor ecosystem.
The day kicked off with a strategic coordination session between the BSIA delegation and a senior team from SK hynix. They discussed the roadshow’s framework and objectives, along with potential collaboration in semiconductor packaging, workforce development, and wider ecosystem building, according to a press release.
Representatives from BSIA member firms — Dynamic Solution Innovators (DSI), Prime Silicon Technology Limited, Siliconova Limited, Ulkasemi Private Limited, and Neural Semiconductor Ltd. — then met with SuperGate to look at joint opportunities in semiconductor design services, verification, embedded systems, AI-focused chip design, and engineering support.
The BSIA delegation also held a bilateral meeting with the Korea Semiconductor Industry Association (KSIA). A key agenda item was the idea of forming a “15-nation semiconductor alliance” to enhance global supply chain resilience, talent mobility, and long-term ecosystem collaboration.
Talks also covered expanding cooperation in talent development via joint training, research projects, academic ties, and workforce programs. Both sides discussed building lasting institutional links between KSIA and BSIA to support the semiconductor sectors in each country.
KSIA leaders acknowledged Bangladesh’s rising semiconductor ambitions, pointing to its demographic strengths, growing pool of engineering talent, and ongoing ecosystem efforts. Attendees noted that with sustained capability growth, strategic partnerships, and consistent policy support, Bangladesh could emerge as the world’s 12th semiconductor hub.
The day wrapped up with a banquet reception co-organized by BSIA and the Embassy of Bangladesh in Seoul. The gathering included industry leaders, policymakers, researchers, academics, and business representatives from both countries.
Remarks were delivered by KSIA leadership, BSIA President M A Jabbar, and Bangladesh Ambassador to South Korea Toufiq Islam Shatil.
Muhammad Mustafa Hussain of Purdue University presented on “Vision of Bangladesh for Semiconductor Packaging,” addressing advanced packaging, heterogeneous integration, AI-driven semiconductor infrastructure, and ecosystem-based value creation.
BSIA member companies highlighted their expertise in semiconductor design, verification, testing, reliability engineering, memory systems, embedded systems, AI hardware, and other engineering services.
Changhyun Kim, Vice President and Head of Packaging & Module at SK hynix, shared a case study on South Korea’s packaging achievements and the transition to AI-era memory packaging technologies.
McKinsey and Company led an insight session on the advanced packaging landscape, underlining the growing importance of 2.5D and 3D architectures, memory-centric AI infrastructure, and advanced packaging as the new “middle-end” of the semiconductor value chain.
BSIA said the South Korea roadshow supports Bangladesh’s broader “Silicon River” vision — an initiative to create a sustainable deep-tech ecosystem by integrating talent, industry, policy support, global partnerships, and strategic infrastructure.
In closing, BSIA invited Korean industry leaders, researchers, and ecosystem partners to the BEAR Summit 2026, scheduled for July 25–26, 2026, in Dhaka.
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