Nov 04, V7N- Nvidia CEO Jensen Huang has urged SK Hynix to expedite the supply of its next-generation HBM4 (high-bandwidth memory) chips by six months, according to SK Group Chairman Chey Tae-won. Initially scheduled for the second half of 2025, SK Hynix's updated timeline now aims for faster delivery, although specific dates were not disclosed. This request underscores Nvidia’s demand for higher-capacity, energy-efficient memory to support its dominant AI chip production, as it commands over 80% of the global AI chip market.
SK Hynix, leading in the high-bandwidth memory chip sector, has experienced high demand for HBM chips critical to the data processing needs of AI development. However, it faces increasing competition from Samsung Electronics and Micron. SK Hynix plans to supply its latest 12-layer HBM3E chips this year and deliver samples of its advanced 16-layer HBM3E in early 2024. Samsung, on its part, reported progress in supply deals and is in discussions to produce enhanced HBM3E chips in the first half of next year, with its own HBM4 production slated for the latter half of 2024.
The news of accelerated production timelines boosted SK Hynix's shares by 5.1% and Samsung's by 1%, with the broader Korean market up 1.6%.
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